W25P16VSSIG T&R

W25P80 / W25P16 / W25P32 8M-BIT, 16M-BIT AND 32M-BIT SERIAL FLASH MEMORY Formally NexFlash NX25P80, NX25P16 and NX25P32 The Winbond W25P80/16/32 are fully compatible with the previous NexFlash NX25P80/16/32 Serial Flash memories. -1- Publication Release Date: December 11, 2005 Revision J W25P80 / W25P16 / W25P32 Table of Contents1. GENERAL DESCRIPTION ......................................................................................................... 4 2. FEATURES ................................................................................................................................. 4 3. PIN CONFIGURATION 208-MIL................................................................................................. 5 4. PIN DESCRIPTION 208-MIL ...................................................................................................... 5 5. PIN CONFIGURATION 300-MIL................................................................................................. 6 6. PIN DESCRIPTION 300-MIL ...................................................................................................... 6 6.1 Package Types ............................................................................................................... 7 6.2 Chip Select (/CS) ............................................................................................................ 7 6.3 Serial Data Output (DO) ................................................................................................. 7 6.4 Write Protect (/WP)......................................................................................................... 7 6.5 HOLD (/HOLD) ............................................................................................................... 7 6.6 Serial Clock (CLK) .......................................................................................................... 7 6.7 Serial Data Input (DI) ...................................................................................................... 7 7. BLOCK DIAGRAM ...................................................................................................................... 8 8. FUNCTIONAL DESCRIPTION ................................................................................................... 9 8.1 8.2 SPI OPERATIONS ......................................................................................................... 9 8.1.1 SPI Modes ........................................................................................................................9 8.1.2 HOLD Function.................................................................................................................9 WRITE PROTECTION.................................................................................................... 9 8.2.1 9. Write Protect Features......................................................................................................9 CONTROL AND STATUS REGISTERS................................................................................... 10 9.1 9.2 STATUS REGISTER .................................................................................................... 10 9.1.1 BUSY..............................................................................................................................10 9.1.2 Write Enable Latch (WEL) ..............................................................................................10 9.1.3 Block Protect Bits (BP2, BP1, BP0)................................................................................11 9.1.4 Reserved Bits .................................................................................................................11 9.1.5 Status Register Protect (SRP) ........................................................................................11 9.1.6 Status Register Memory Protection ................................................................................12 INSTRUCTIONS........................................................................................................... 13 9.2.1 Manufacturer and Device Identification...........................................................................13 9.2.2 Instruction Set (1).............................................................................................................14 9.2.3 Write Disable (04h).........................................................................................................15 9.2.4 Write Enable (06h)..........................................................................................................15 9.2.5 Read Status Register (05h) ............................................................................................16 9.2.6 Write Status Register (01h) ............................................................................................17 9.2.7 Read Data (03h) .............................................................................................................18 -2- W25P80 / W25P16 / W25P32 10. 11. 9.2.8 Fast Read (0Bh) .............................................................................................................19 9.2.9 Page Program (02h) .......................................................................................................20 9.2.10 Sector Erase (D8h).......................................................................................................21 9.2.11 Chip Erase (C7h)..........................................................................................................22 9.2.12 Power-down (B9h) ........................................................................................................23 9.2.13 Release Power-down / Device ID (ABh) .......................................................................23 9.2.14 Read Manufacturer / Device ID (90h) ...........................................................................25 9.2.15 JEDEC ID (9Fh)............................................................................................................26 9.2.16 Read Parameter Page (53h).........................................................................................27 9.2.17 Fast Read Parameter Page (5Bh) ................................................................................28 9.2.18 Program Parameter Page (52h) ...................................................................................29 9.2.19 Erase Parameter Page (D5h) .......................................................................................31 ELECTRICAL CHARACTERISTICS......................................................................................... 32 10.1 Absolute Maximum Ratings (1) .................................................................................... 32 10.2 Operating Ranges......................................................................................................... 32 10.3 10.4 Power-up Timing and Write Inhibit Threshold .............................................................. 33 DC Electrical Characteristics (Preliminary)(1) .............................................................. 34 10.5 AC Measurement Conditions........................................................................................ 35 10.6 AC Electrical Characteristics ........................................................................................ 36 10.7 Serial Output Timing ..................................................................................................... 38 10.8 Input Timing .................................................................................................................. 38 10.9 Hold Timing................................................................................................................... 38 PACKAGE SPECIFICATION .................................................................................................... 39 11.1 8-Pin SOIC 208-mil (Winbond Package Code SS) (NexFlash Package Code S)........ 39 11.2 16-Pin SOIC 300-mil (Winbond Package Code SF)(NexFlash Package Code F)....... 40 12. ORDERING INFORMATION .................................................................................................... 41 13. REVISION HISTORY ................................................................................................................ 42 -3- Publication Release Date: December 11, 2005 Revision J W25P80 / W25P16 / W25P32 1. GENERAL DESCRIPTION The W25P80 (8M-bit), W25P16 (16M-bit) and W25P32 (32M-bit) Serial Flash memories provide a storage solution for systems with limited space, pins and power. They are ideal for code download applications as well as storing voice, text and data. The devices operate on a single 2.7V to 3.6V power supply with current consumption as low as 4mA active and 1µA for power-down. Devices are offered in space-saving SOIC packages. As part of a family of Serial Flash products, Winbond also offers compatible devices in 1M/2M/4M-bit densities. The W25P80/16/32 array is organized into 4,096/8,192/16,384 programmable pages of 256-bytes each. Up to 256 bytes can be programmed at a time using the Page Program instruction. Pages are grouped into 16/32/64 erasable sectors of 256 pages (64K-byte) each as shown in figure 2. Both Sector Erase and Chip (full chip) Erase instructions are supported. Additionally, a 256-byte Parameter Page is provided for user data that is typically stored in EEPROMs such as ID or revision numbers and configuration parameters. The parameter page is separate from the main array allowing for much faster erase times. The Serial Peripheral Interface (SPI) consists of four pins (Serial Clock, Chip Select, Serial Data In and Serial Data Out) that support high speed serial data transfers up to 50MHz. A Hold pin, Write Protect pin and programmable write protect features provide further control flexibility. Additionally, the device can be queried for manufacturer and device type. The Winbond W25P80/16/32 are fully compatible with the previous NexFlash NX25P80/16/32 Serial Flash memories. 2. FEATUR ES • 8M / 16M / 32M-bit Serial Flash Memories • Programming Features – Page program up to 256 bytes in 3.5ms – Sector Erase (64K-byte) 0.6 seconds – 100,000 erase/write cycles – Twenty-year data retention • Family of Serial Flash Memories – W25P80: 8M-bit/1M-byte (1,048,576) – W25P16: 16M-bit/2M-byte (2,097,152) – W25P32: 32M-bit/4M-byte (4,194,304) – 256-bytes per programmable page – Compatible 1M/2M/4M-bit devices • Software and Hardware Write Protection – Write-Protect all or portion of memory – Enable/Disable protection with /WP pin • 4-pin SPI Serial Interface – Clock, Chip Select, Data In, Data Out – Easily interfaces to popular microcontrollers – Compatible with SPI Modes 0 and 3 – Optional Hold function for SPI flexibility • Parameter Page – 256 Byte page for ID# revision# or configuration data – Separate from array, erase time